3D Large Area Laser Processing System

3D Large Area Laser Processing System

The 3D Large Area Laser Processing System consists of an XY galvo, a dynamic focusing module, a control card and host software. By moving the dynamic focusing mirror the focus stays on the workpiece surface, so spots across the whole marking field keep the same, small diameter. As a three-axis galvo scan head it is used in high-end processing: precision laser marking, laser relief, deep carving, laser cutting and laser welding. Configurations are engineered per laser type — CO₂, UV and infrared — with the field size, spot diameter and working distance matched for each.

Key Features:

  • High-speed three-axis electro-optical galvanometer, the response time of high-power driver is 1.2ms.
  • Repeatable positioning accuracy<2urad, with long-term drift <100urad.
  • New dynamic axis design, with low friction resistance for stable long-term operation.
  • Compatible with the GMC control card, completing calibration tables before delivery to minimize calibration workload during customer integration.

Specifications of 3D Large Area Laser Processing System

Parameter Specifications
Product 3D Large Area Laser Processing System
Type Three-axis galvanometer scan head with dynamic focusing module (3D / 2.5D)
System Composition XY galvo, dynamic focusing module, control card and host software
Control Card GMC compatible; calibration tables completed before delivery
Coating Options Configurations tuned for CO₂, UV and infrared lasers
Typical Applications Laser precision marking, laser relief, deep carving, laser cutting and laser welding
3D Large Area System CO₂ UV Infrared
Scan Angle (°) ±22 ±22 ±22
System Calibration Accuracy ≤ 0.1 mm (field size ≤ 800 × 800 mm) ≤ 0.1 mm (field size ≤ 800 × 800 mm) ≤ 0.1 mm (field size ≤ 800 × 800 mm)
Repeatability (µrad) 2 5 2
Max. Gain Drift (ppm/K) 80 8 80
Max. Offset Drift (µrad/K) 15 15 15
Long-term Drift Over 8 h (mrad) ≤ 0.3 ≤ 0.1 ≤ 0.3
Tracking Error (ms) ≤ 0.70 ≤ 0.45 ≤ 0.30 / ≤ 0.45 / ≤ 0.7
Wavelength (nm) 10600 355 1064
Input Beam Aperture (mm) 15 6 7 / 10
Aperture Size (mm) 30 20 14 / 20 / 30
Maximum Laser Power, CW (W/cm²) 1000 300 1500

Configuration Example of CO₂ Laser

Field Size (mm × mm × mm) 1/e² Smallest Spot Diameter (µm) Working Distance (mm)
100 × 100 × 0 181 96.5
250 × 250 × 10 304 241.5
500 × 500 × 150 568.2 550.5
750 × 750 × 300 832 860.5
1000 × 1000 × 500 1096 1169.5
1250 × 1250 × 700 1360 1478.5
1500 × 1500 × 900 1625 1788.5
2000 × 2000 × 1400 2145 2407.5

Configuration Example of UV Laser

Field Size (mm × mm × mm) 1/e² Smallest Spot Diameter (µm) Working Distance (mm)
200 × 200 × 30 11 212
300 × 300 × 50 15 309
500 × 500 × 100 26 556
700 × 700 × 150 34 804
1000 × 1000 × 240 46 1175
1200 × 1200 × 320 55 1423

Configuration Instance of Infrared Laser (14 mm)

Field Size (mm × mm × mm) 1/e² Smallest Spot Diameter (µm) Working Distance (mm)
200 × 200 × 40 45.2 177.4
250 × 250 × 60 52.1 239.3
300 × 300 × 80 60.7 301.2
350 × 350 × 100 70 363
400 × 400 × 120 79.3 425

Configuration Instance of Infrared Laser (20 mm)

Field Size (mm × mm × mm) 1/e² Smallest Spot Diameter (µm) Working Distance (mm)
200 × 200 × 30 25.75 184.7
400 × 400 × 70 49 432.2
500 × 500 × 100 65 618.8
600 × 600 × 120 77 679.7
700 × 700 × 150 89 866.3
800 × 800 × 180 101 927.2
900 × 900 × 220 113 1113.8
1000 × 1000 × 240 125 1174.7
1200 × 1200 × 320 148.5 1422.2

Configuration Instance of Infrared Laser (30 mm)

Field Size (mm × mm × mm) 1/e² Smallest Spot Diameter (µm) Working Distance (mm)
800 × 800 × 50 70 921.6
1000 × 1000 × 200 84 1169.1
1200 × 1200 × 450 100 1416.6
1300 × 1300 × 550 108 1540.3
1400 × 1400 × 700 116 1664.1
1500 × 1500 × 850 124 1787.9

Data Sheet: 3D Large Area Laser Processing System (PDF)

Configurations are engineered for CO₂, UV and infrared lasers. Tell us your laser type, field size and working distance and we will quote the matching scan head.